“The new platform offers continued support for ECC on select processor SKUs to ensure data integrity, and the introduction of next generation I/O?such as integrated PCI Express Gen 3.0 and USB 3.0?enables processing of a significant amount of data over the 2nd generation Intel® Core™ processor family at lower or same thermal footprint.” “The 3rd generation Intel® Core™ processor-based platform delivers best-in-class performance and reliability for ruggedized applications,” said Matt Langman, director of marketing, Intel Intelligent Systems Group. “This platform delivers higher performance per watt over previous-generation processors – a feature that is critical for rugged applications requiring high performance in high temperature environments.” “ADLINK’s Express-IBR is equipped with the 3rd generation Intel® Core™ processor, which utilizes Intel’s new 3D tri-gate transistor technology and 22nm process technology,” said Jeff Munch, CTO of ADLINK Technology and chair of the COM Express COM.0 R2.1 Sub-committee.
Following ADLINK's Rugged By Design methodology, the Express-IBR is ideal for use in environments prone to severe shock, vibration, humidity, and extended temperature ranges. The Ampro by ADLINK™ Express-IBR is a COM Express Type 6 module that supports the quad-core and dual-core 3rd generation Intel® Core™ i7 processors and Mobile Intel® QM77 Express chipset. ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the release of its latest Ampro by ADLINK™ Extreme Rugged™ COM Express® module, the Express-IBR for airborne and vehicle-mounted military computers and human machine interfaces (HMI) applications required to function in harsh environments.
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